ADVANTEST BLG-022829 Heated Wafer Carrier, High Precision Semiconductor Testing Equipment

Temperature Range:-20°C to +200°C

Heating Rate:0.5°C/s

Resolution:0.01°C

Stability:+/- 0.1°C over 24 hours

Cooling Capability:Instantaneous temperature drop to ambient within 5 minutes

Max Load Capacity:200g

Material:Stainless Steel

Size:120mm x 120mm

Power Supply:12V DC

Dimensions:150mm x 150mm x 30mm

Weight:2.5kg

    The ADVANTEST BLG-022829 Heated Wafer Stage is engineered to offer unparalleled precision in temperature control during semiconductor fabrication processes, ensuring optimal results and reducing the risk of defects.

    Featuring a robust stainless steel construction, this heated wafer stage ensures durability and resistance to corrosive environments commonly found in cleanrooms.

    With its fast heating rate of 0.5°C per second, this module significantly accelerates the processing time without compromising temperature accuracy, making it an indispensable tool for high-efficiency semiconductor production lines.

    Equipped with advanced temperature stability features, the BLG-022829 maintains a remarkable precision of +/- 0.1°C over a 24-hour period, ensuring consistent performance throughout long production cycles.

    Designed for ease of integration, the heated wafer stage comes with a standard 12V DC power supply and compact dimensions, facilitating its use in a wide range of existing manufacturing setups.